Hi-Q purchases a 3-wavelength Ledia direct imager
Hi-Q has invested in a Ledia SD-53 from Ucamco. Selected primarily for its precision, front-to-back registration reliability and its unbeatable soldermask capabilities, this 5-head 3-wavelength system will be used to image inner- and outer-layer dry films and soldermasks.
With Ledia, Hi-Q knows it can guarantee its clients even better service, perfect quality features with virtually no undercut, and robust, stable soldermask dams even on its finest sub-50 µm HDI boards.
Hi-Q's decision to purchase its Ledia system followed careful benchmarking tests, during which Ledia's performance put it head and shoulders above the rest. The results were impressive, but before investing in its future, Hi-Q decided to ask a real expert, a leading European PCB manufacturer and Ledia owner, how the technology stacks up in real life. In open, honest discussions with the shop-floor operators who know Ledia best, Hi-Q got the confirmation it needed that Ledia is simply the best direct imaging technology on the market in terms of real-time reliability, repeatability and production quality, but also for its throughput speed, unsurpassed uptime, and low operation costs