Ucamco announces new Ledia models with 3 wave lengths
Ledia – optimising the light fantastic
September 25th 2015 - Ucamco is delighted to announce the new 3 Wavelength series of Ledia Direct Imaging (DI) systems for the accurate, high-speed exposure of the industry's most demanding soldermask, inner-layer and outer-layer resists.
When it comes to the direct imaging of PCB materials, Dai Nippon Screen's Ledia multi-wavelength UV LED DI platform has always led the field. First, with its 2 Wavelength Ledia imaging systems, Screen delivered unprecedented DI throughputs on even the most demanding inner- and outer-layer resists, and it gave PCB manufacturers the very first DI technology with which to process standard soldermask resists accurately and at production speeds.
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